集成電路封裝材料的錶徵 pdf epub mobi txt 電子書下載 2025

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[美] 布倫德爾，埃文斯，摩爾著

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齣版社：哈爾濱工業大學齣版社

ISBN：9787560342825

版次：1

商品編碼：11402698

包裝：平裝

叢書名：材料錶徵原版係列叢書

開本：16開

齣版時間：2014-01-01

用紙：膠版紙

具體描述

內容簡介

　　《集成電路封裝材料的錶徵(英文)》的主要內容包括： Foreword；Preface to the Reissue of the Materials Characterization Series xiii；Preface to Series xiv；Preface to the Reissue of Integrated Circuit Packaging Materials xv；Preface xvi；Contributors xix等。

Foreword xi
Preface to the Reissue of the Materials Characterization Series xiii
Preface to Series xiv
Preface to the Reissue of Integrated Circuit Packaging Materials xv
Preface xvi
Contributors xix
IC PACKAGE RELIABILITY TESTING
MOLD COMPOUND ADHESION AND STRENGTH
MECHANICAL STRESS IN IC PACKAGES
MOISTURE SENSITMTY AND DELAMINATION
THERMAL MANAGEMENT
ELECTRICAL PERFORMANCE OF IC PACKAGES
SOLDERABILITY OF INTEGRATED CIRCUITS
HERMETICITY AND JOINING IN CERAMIC IC PACKAGES
ADVANCED INTERCONNECT TECHNOLOGY
APPENDIX： TECHNIQUE SUMMARIES